Solder-bearing land
US5441429A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 18, 1993 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Aug 18, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder-bearing lead adapted to be soldered to a conductive surface comprises an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on one or both of the opposed faces of said solder-bearing portion. A region of the middle portion is twisted or the projections are bent so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surface-mounted lead for a substrate. The lead is arranged to provide, during soldering, direct metal-to-metal contact with the conductive area to which it is to be soldered, to avoid shifting of the parts due to molten solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.