Sputtering apparatus and method
US5441615A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1994 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Dec 6, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3447
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The sputtering apparatus includes: at least one film-forming vacuum chamber in which a plurality of sputtering targets and a like plurality of box-shaped deposition-shield members are disposed, each deposition-shield surrounding the corresponding target in such a manner that each of the targets faces a corresponding substrate, each deposition-shield member having an opening which enables sputtered particles to travel from the target to the corresponding substrate. The arrangement of the sputtering apparatus may be such that the substrate is supported by a holder and the substrate holder is placed facing the opening provided in a wall of the deposition-shield member, wherein the area of the substrate holder is larger than that of the opening of the deposition-shield member, and a part of the area of the substrate holder which faces the wall of the deposition-shield member overlaps a closed portion of the deposition-shield member when viewed in plan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.