Patent · US Expired

Method of manufacturing a compound body and the resulting body

US5441764A · kind A · utility

1Cited by
22References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 30, 1994
Grant dateAug 15, 1995
Priority date
Expiry dateJun 30, 2014

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2235/6582
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

According to the present invention there is provided a method of manufacturing a compound body having at least one, partly covering layer on a porous body, whose pore system is evacuate by means of a subpressure which is applied on the porous body by a suction cup or the like and the body is dipped in a slurry of powdery components of the layer. The compound body is densified by sintering or other heat treatment, e.g., post-HIP.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.