Pack coating process for articles containing small passageways
US5441767A · kind A · utility
16Cited by
2References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 26, 1994 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Jan 26, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/322
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for reducing the tendencies of small holes to become packed with particulate material during pack cooling. An organic substance is used to wholly or partially fill small holes prior to placing the part in the packed cooling material. The organic material decomposes during the packed cooling process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.