Method for use of preflux, printed wiring board, and method for production thereof
US5441814A · kind A · utility
7Cited by
7References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 12, 1993 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Nov 12, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board comprising a preflux film of a benzimidazole copper complex, wherein the benzimidazole copper complex is formed by (i) applying a preflux to the printed wiring board and (ii) performing an oxidizing treatment of the preflux coated wiring board sufficient to form a benzimidazole copper complex wherein said complex is substantially free of free imidazole groups from the benzimidazole preflux.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.