Photosensitive polyimide precursor composition
US5442024A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1994 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Apr 26, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0755
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive polyimide precursor composition of the present invention comprises a polyimide precursor represented by the formula (6) EQU (OR.sup.5).sub.k R.sup.4.sub.3-k Si--R.sup.3 --X--Z (6) and having a logarithmic viscosity number of 0.1 to 5.0 dl/g measured in N-methyl-2-pyrrolidone at 30.degree. C. and a compound capable of generating an acid by light irradiation, said polyimide precursor being obtained by reacting A mol of a tetracarboxylic dianhydride, B mol of a diamine, and C mol of an aminosilane so as to meet the relations of the equations: ##EQU1## This composition not only has practical photosensitivity but also inhibits the reduction of film thickness due to curing and development, and it is also excellent in shelf stability in varnish and adhesive properties to a substrate such as a silicon wafer or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.