Patent · US Expired

Method and apparatus for forming thin film and multilayer film

US5443646A · kind A · utility

327Cited by
5References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 12, 1994
Grant dateAug 22, 1995
Priority date
Expiry dateOct 12, 2014

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/52
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A thin film is formed on a substrate in a reaction chamber using a photo CVD technique by decomposing a reactive gas supplied to the reaction chamber by means of light irradiated through a light introducing window. The reduction in film deposition rate due to clouding of the light introducing window is corrected in order to form a thin film of a desired film thickness.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.