Flux for soldering and solder composition comprising the same and soldering method using the same
US5443659A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1994 |
| Grant date | Aug 22, 1995 |
| Priority date | — |
| Expiry date | Nov 3, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.