Halogen-free flameproofed thermoplastic molding materials based on polyphenylene ethers and polystyrene

US5444123A · kind A · utility

Assignee

• BASF SE

Inventors

• Doris Zeltner · Wasserburg am Inn, DE
• Norbert Niessner · Friedelsheim, DE
• Friedrich Seitz · Friedelsheim, DE
• Ranier Neumann · Mutterstadt, DE
• Stefan Seelert · Bischofswerda, DE

Key dates

• Filing date: Feb 28, 1994
• Grant date: Aug 22, 1995
• Expiry date: Feb 28, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L71/12
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Halogen-free flameproofed thermoplastic molding materials based on polyphenylene ethers and polystyrene containing, as essential components, A) from 5 to 92% by weight of one or more polyphenylene ethers, B) from 5 to 92% by weight of a vinylaromatic polymer and C) from 3 to 25% by weight of a flameproofing agent based on C1) from 20 to 100% by weight (based on the total amount of C) of a polymeric phosphorus compound which is obtained by polymerizing or copolymerizing one or more compounds of the following structure: ##STR1## where ##STR2## R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.10 and R.sup.11 are each hydrogen, alkyl, cycloalkyl, aralkyl or aryl, PA1 R.sup.7, R.sup.8 and R.sup.9 are each alkylidene, cycloalkylidene, aralkylidene or arylidene, PA1 m, p, q, r, s, t, u and v are each 0 or 1, PA1 n is 0, 1 or 2, PA1 U is COO, O, S or NR.sup.9, PA1 V, W, X and Y are each O, S or NR.sup.9 and PA1 Z is O, S or NR.sup.10 R.sup.11, and C2) from 0 to 80% by weight (based on the total amount of C) of a low molecular weight phosphorus compound selected from the group consisting of the phosphine oxides, phosphates, phosphinic acids and salts and esters thereof, phosphonic acids a…