Solid imaging pick-up element
US5444277A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1994 |
| Grant date | Aug 22, 1995 |
| Priority date | — |
| Expiry date | Jul 13, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/153
Abstract
A solid image pick-up element has a pixel region, an output region located near the pixel region, and a field portion located remote from the pixel region, all of which are formed at un upper layer of a semiconductor substrate. The pixel region is provided with plural rows of light receiving portions for performing photoelectric conversion with respect to light received thereby. Between the plural rows of the light receiving portions are interposed transfer portions for transferring signals obtained through the photoelectric conversion. The output region is provided with an output portion for outputting the signals transferred from the transfer portions. The semiconductor substrate is covered with three dielectric films, and an opening is formed through two dielectric films at a location above the output portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.