Semiconductor device having a radiating part
US5444304A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1993 |
| Grant date | Aug 22, 1995 |
| Priority date | — |
| Expiry date | Aug 24, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device constituted by a VSMP (Vertical Surface Mount Package) is provided in which a thickness of a plastic package encapsulating a semiconductor chip is very small, wherein even when a semiconductor chip having large power consumption is contained therein, the effect of heat radiation can be effectively improved. A VSMP constituting the semiconductor device, which is mounted perpendicularly on a surface of a substrate, includes: external connection terminals for supplying I/O signals from peripheral circuits and electric power to the semiconductor chip; supporting terminals for holding the VSMP in a perpendicularly-mounted state; a plastic package for protecting the internal elements; and radiating fins with an irregular configuration provided on both sides of the plastic package. The radiating fins having the irregular configuration are formed so as to extend in a direction of a length of the semiconductor device and are formed on both the front side and the rear side of the plastic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.