Quick cure exhaust manifold
US5444923A · kind A · utility
16Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1993 |
| Grant date | Aug 29, 1995 |
| Priority date | — |
| Expiry date | Apr 13, 2013 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B5/12
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention is directed to a manifold 10 that is used in conjunction with a die attach cure station for providing a "quick cure" of the die mount adhesive, and for forcing contaminants away from the semiconductor die 33 surface. The manifold has an air put port 21 directly above the semiconductor die. Forced air is directed through the port. At each side of the forced port are vacuum ports 20,22 through which a vacuum is applied to draw air and heated die attach contaminants from the die surface. Air is also drawn from below and around the die mounting area to provide a stream of air that is drawn into the vacuum ports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.