Curable release compositions comprising novel silicone adhesion modifier
US5446087A · kind A · utility
18Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1993 |
| Grant date | Aug 29, 1995 |
| Priority date | — |
| Expiry date | Dec 6, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/80
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Unique silicone adhesion modifiers well suited for formulation into curable release compositions containing a linear polydiorganosiloxane, comprise an organopolysiloxane resin (A) containing at least 0.1 mol % of alkenyl or alkenyloxyalkylene radicals directly bonded to silicon atoms, an organopolysiloxane resin (B) containing at least 0.5 mol % of hydrogen atoms directly bonded to silicon atoms, and a solvent/diluent (C) for the resins (A) and (B).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.