Semiconductor device including a first chip having an active element and a second chip having a passive element
US5446309A · kind A · utility
39Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1993 |
| Grant date | Aug 29, 1995 |
| Priority date | — |
| Expiry date | May 28, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first chip and a second chip. Active elements such as transistors are fabricated on the surface of the semiconductor substrate of the first chip. Passive elements such as inductors and capacitors are fabricated on the second chip. The first chip is so disposed on the second chip that the reverse surface of the first chip makes a contact onto the surface of the second chip. The active element and the passive element are electrically connected by bonding wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.