Method for manufacturing a frequency control device
US5446954A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1993 |
| Grant date | Sep 5, 1995 |
| Priority date | — |
| Expiry date | Sep 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing is employed to produce a size-reduced frequency control device (300), according to the present invention. A temperature compensation circuit (304) and an unsealed piezoelectric element (302) are disposed on a substrate (306) such that the compensation circuit and the unsealed piezoelectric element are electrically connected. A hermetic seal (318) is established between a lid (308) and the substrate such that the unsealed piezoelectric element and at least a temperature sensitive portion of the temperature compensation circuit occupy a sealed environment (320). In this manner, dimensions (322, 324) of the frequency control device are reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.