Conductive powder coating materials and process for the preparation thereof
US5447791A · kind A · utility
6Cited by
9References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1994 |
| Grant date | Sep 5, 1995 |
| Priority date | — |
| Expiry date | Oct 26, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Submicron to micron sized conductive particles, on the order of 0.05 to 5 micron in average particle diameter, are produced using a semisuspension polymerization process in which the aqueous phase of the suspension contains an inorganic salt such as potassium iodide. The inorganic salt inhibits the formation of polymer particles that do not contain conductive filler so as to be non-conductive. The process also allows for conductive filler to be added at the start of the process. Powder coatings made from the submicron sized conductive particles have a high and uniform conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.