Semiconductors with protective layers
US5448095A · kind A · utility
4Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1993 |
| Grant date | Sep 5, 1995 |
| Priority date | — |
| Expiry date | Dec 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A combination of layers protects a semiconductor device from electrostatic discharge during dicing. A polymer layer coats the device, wherein the polymer layer has an aluminum layer on its outer surface and wherein the aluminum layer electrically connects the wire bonding pads of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.