Cooling of semiconductor power modules by flushing with dielectric liquid
US5448108A · kind A · utility
22Cited by
6References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1993 |
| Grant date | Sep 5, 1995 |
| Priority date | — |
| Expiry date | Nov 2, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor dies (30-40) are mounted on a printed wiring board (28) to be vertically oriented. They are enclosed in a housing (12) which is supplied with an upwardly flowing dielectric liquid coolant. Nozzles (18,20) direct the dielectric liquid coolant to flow upward over the dies and printed wiring board. Heat is directly extracted from the dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.