Method of producing boards for printed wiring
US5449480A · kind A · utility
160Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1993 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Apr 14, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of producing a board for printed wiring comprising disposing a metal foil in a plate-shape cavity of a mold so that the metal foil is in contact with at least one internal side of the cavity, injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic filler into the cavity and curing the epoxy resin, the molding material containing 50 to 90% by volume of the powdery inorganic filler based on the total of the molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.