Photosensitive polyimide precursor composition with photoacid generator
US5449588A · kind A · utility
5Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1994 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | May 27, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/075
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition containing 0.5 to 15 parts by weight of a compound generating an acid by light irradiation in 100 parts by weight of a polyamic acid amide having an alkoxysilane having a specified structure at its terminals are provided, PA1 which composition has superior resolution properties, a small shrinkage of volume, a superior adhesion onto a substrate, and can prepare a polyimide by baking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.