Method of bonding multilayer structures of crystalline materials
US5449659A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1992 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Nov 9, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/702
Abstract
A method for producing multilayer structures comprised of materials with incompatible processing parameters is disclosed. A bonding layer of arbitrary dielectric constant is applied to each of two substructures. Each substructure is composed of a substrate and at least one epitaxial crystalline layer. Examples of particular bonding materials used are polyimide, fluorocarbon polymers, other organic materials, and glass. The bonding material may be applied like photoresist, or sputtered, or applied in any appropriate manner consistent with the processing constraints of the crystalline materials. Structures formable in this way include superconductor-amorphous dielectric-superconductor and ferroelectric-insulator-semiconductor trilayers, as well as microwave resonators and multichip modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.