Film circuit metal system for use with bumped IC packages
US5449955A · kind A · utility
12Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1994 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Apr 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer composite interconnection for use in circuits including thin film elements and electrical interconnections includes a copper barrier layer interposed between a nickel layer and a gold layer of the interconnection. The copper layer is in a thickness sufficient to bar or at least to restrict diffusion of nickel through the gold layer under processing and operating conditions. The interconnection multilayer composite interconnection includes in an ascending order, titanium, palladium or palladium-titanium alloy, copper, nickel, copper barrier and gold layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.