Thermal head for a printer
US5450101A · kind A · utility
20Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1994 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Jul 12, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/361
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A circuit terminal of a thermal head substrate is connected to a flexible printed circuit by an electroconductive adhesive or a solder metal. An overcoating composed of an insulating or extra-low electroconductive material is applied to cover a region containing a connected portion between the circuit terminal and the flexible printed circuit and to cover an exposed portion of the circuit terminal to thereby prevent corrosion of the circuit terminal, improve the mechanical strength of the flexible printed circuit connection, and prevent a short-circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.