Printed circuit having a dielectric covercoat
US5450286A · kind A · utility
28Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1994 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Jun 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit assembly includes a rigidizer having first and second opposing surfaces, a silicone bonding agent disposed over a first surface of the rigidizer, a flex circuit having first and second opposing surfaces with a first surface of the flex circuit disposed over the bonding agent, and a silicone covercoat disposed over selected portions of the second surface of the flex circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.