Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate
US5450288A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1993 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Sep 14, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed chip-on-board substrate is for mounting a high-power semiconductor chip. As a construction for efficiently releasing or dissipating heat to be generated in the semiconductor chip, the printed substrate has a printed interconnected substrate and a metal plate bonded on a back side of the substrate. The printed interconnected substrate is constructed by forming an interconnected layer on a surface of the substrate. At a mount area where the semiconductor chip is to be mounted, an opening is formed reaching the metal plate. The metal plate covers the opening on the side of the back side and is formed with a thickness capable of providing rigidity sufficient to support thereon at least the semiconductor chip to be mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.