Method and apparatus for cooling sensors in high temperature environments
US5450753A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1992 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Dec 14, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/02872
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Sensor assemblies, comprising one or more sensors for use in high-temperature environments such as an aircraft wing, include a thermally conductive retaining member in thermal communication with either the sensor or the environment surrounding the sensor. A housing assembly placed proximate to, and in thermal communication with, the retaining member defines a fluid passageway. During operation, fluid circulates through the housing to enhance the transfer of heat away from the sensor. Such heat transfer facilitates maintaining a sensor environment within the tolerance range of the sensor, thereby facilitating monitoring of the pressure fluctuation (or other sensor parameter) during operation of the aircraft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.