Process for the wet-chemical treatment of disk-shaped workpieces

US5451267A · kind A · utility

Assignee

• Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

• Max Stadler · Haiming, DE
• Gunter Schwab · Emmerting, DE
• Peter Romeder · Burghausen, DE

Key dates

• Filing date: May 11, 1994
• Grant date: Sep 19, 1995
• Expiry date: May 11, 2014

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B08B3/102
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A process for the wet-chemical treatment of workpieces, especially of semiconductor wafers, includes exposing the workpieces to a flow of a gassified treatment medium generated by homogeneously dispersing gas bubbles in a liquid.