Moulding process
US5451362A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1993 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Nov 18, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a process for making a cured plastics moulding by introducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition, wherein the curable resin is an epoxy resin formulation comprising an epoxy resin containing more than one epoxide group per molecule on average, an acid anhydride hardener, an accelerator and a filler, the epoxy resin, hardener and accelerator being chosen so that the formulation is stable at 25.degree. C. for at least 14 days.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.