Method and apparatus for treating freshly metallized substrates
US5451429A · kind A · utility
2Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 1994 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Aug 19, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C2/261
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for treating a freshly metallized substrate in which a metal substrate is passed through a bath of molten metal for the purpose of applying a coating thereto while a treating gas containing a reducing gas, a non-oxidizing gas or combination thereof is provided at the region where the metallized substrate exits the molten metal bath to thereby at least reduce oxidation of the metallized substrate and the surface of the molten metal bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.