Packaging film comprising a sealing layer and a substrate layer
US5451468A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1993 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Sep 14, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A packaging film contains PA1 a) a sealing layer of a mixture of from 50 to 80% by weight of a random terpolymer (I) of from 90 to 97% by weight of propylene, from 2 to 6% by weight of ethylene and from 1 to 6% by weight of a C.sub.4 -C.sub.10 -alk-1-ene and from 20 to 50% by weight of at least one ethylene polymer (II) PA1 b) and a substrate layer of a thermoplastic polymer. The novel packaging film possesses in particular good sealability over a wide temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.