Thermoplastic resin composition and article comprising the same
US5451642A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1994 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Dec 23, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L23/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition containing a polyamide resin composition (C) consisting of a polyamide resin (A) and another thermoplastic resin (B) and at least one modifier (D) is excellent in coatability, mechanical properties, linear expansion coefficient and appearance, can be molded into an article which comprises the polyamide resin (C), wherein the ratio of the percent occupied area of the polyamide resin on the surface of the article to the weight percentage of the polyamide in the polyamide resin composition (C) is not less than 1.2, and/or the ratio of the percent concentration of the polyamide resin on the surface of the article determined on the basis of the nitrogen concentration on the surface of the article to the weight percentage of the polyamide in the polyamide resin composition (C) is not less than 1,2, which article is suited for electric and electronic parts and automobile parts such as a bumper, fender and wheel cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.