Multi-chip module integrated circuit
US5451814A · kind A · utility
16Cited by
0References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 1, 1993 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Mar 1, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module semiconductor device including a plurality of IC chips arranged in a side-by-side relationship on a supporting member such as a tab is provided. Each of the IC chips is provided with an array of bonding pads for connection with the exterior of the device only along such side to which no other IC chip is disposed adjacent thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.