Pad arrangement for surface mount components
US5453581A · kind A · utility
40Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1993 |
| Grant date | Sep 26, 1995 |
| Priority date | — |
| Expiry date | Aug 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pad arrangement (100) for aligning and attaching a surface mount component (402) with other circuitry includes a substrate (102) upon which opposing pads (108) are attached. Each of the pads occupies a substantially rectangular area (110) having four sides. In order to facilitate alignment of the surface mount component the substantially rectangular area has two opposing flat sides an outwardly extending arcuate area (112) along at least one of the other two sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.