Circuit board to be precoated with solder layers and solder circuit board
US5453582A · kind A · utility
52Cited by
8References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 1, 1995 |
| Grant date | Sep 26, 1995 |
| Priority date | — |
| Expiry date | Mar 1, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.