Patent · US Expired

Bonding and encapsulated three dimensional hybrid integrated circuit modules

US5453638A · kind A · utility

7Cited by

2References

9Claims

0Family size

Assignee

Daimler-Benz Aerospace AG · DE

Inventors

Dieter Nagele · Echterdingen, DE
Manfred Weinacht · Dettingen unter Teck, DE
Klaus-Erich Färber · Gifhorn, DE

Key dates

Filing date	Aug 4, 1993
Grant date	Sep 26, 1995
Priority date	—
Expiry date	Aug 4, 2013

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16152
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

System for packaging integrated circuits, especially sensors, in a housing, which also comprises multicontact bondings, especially hybrid ICs for three-dimensional arrangement of modules, wherein sensors (4, 5) are arranged at an angle in relation to one another on the base plate or the substrate (1). The sensors are contained in the single housing together with contact pins (pins) (2), and are connected in one plane by automatic bonding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.