Bare die test and burn-in device
US5453701A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1994 |
| Grant date | Sep 26, 1995 |
| Priority date | — |
| Expiry date | Feb 22, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Bare die test device for making temporary electrical connections between bonding pads on the die and external test connectors includes a die chuck, a fanout substrate, and a substrate chuck. The fanout substrate has conductive bumps spaced for registration with die bonding pads. A die chuck receives the die and a substrate chuck holds the fanout substrate. In a fixed alignment embodiment, an alignment arrangement between the die chuck and the substrate chuck provides registration. In an alternative embodiment, the fanout substrate has a backside etched cavity exposing a transparent compliant material. A lower frame provides for lateral and angular positioning of the die chuck relative to the substrate chuck to bring the conductive bumps into alignment with the bonding pads, while visually observing the alignment through the transparent material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.