Method for obtaining metallurgical stability in integrated circuit conductive bonds
US5455195A · kind A · utility
35Cited by
14References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | May 6, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/904
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for electrically connecting integrated circuit copper-gold ball bond that connect a bond wire (18) with a bond pad (14) forms a palladium layer (16) in the electrical connection between the bond wire (18) and the bond pad (14). The connection avoids excessive stresses that arise from intermetallic formations between the bond wire (18) and the bond pad (14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.