Method of manufacturing frame for LEDs
US5455199A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 10, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Feb 10, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED manufacturing process using a frame comprises a first tie bar extending longitudinally of the frame, a second tie bar also extending longitudinally of the frame substantially in parallel to the first tie bar, and plural groups of first to fourth consecutive leads connecting between the first and second tie bars. The first and third leads have respective extensions extending transversely beyond the first tie bar to provide first side pairs of chip bonding and wire bonding ends. Similarly, the second and fourth leads have respective extensions extending transversely beyond the second tie bar to provide second side pairs of chip bonding and wire bonding ends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.