IC package heat sink fin
US5455382A · kind A · utility
20Cited by
14References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Nov 3, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fin assembly for use as a heat sink and production thereof are disclosed. The fin assembly comprises a plurality of heat dissipating plates formed by means of a multi-wire saw, and the heat dissipating plates each has a thickness t of no more than 1 mm and being spaced apart by a gap g of no more than 1.5 mm the heat dissipating plates or pins having a height h, wherein the ratio h/t is not less than 20 and the ratio h/g is not less than 15 in one embodiment and 19 in another embodiment of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.