Chamfered electronic package component
US5455386A · kind A · utility
28Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Jan 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed an adhesively sealed electronic package in which a compensation apparatus is provided for excess adhesive. As a result, excess adhesive does not extend beyond the package perimeter, squeeze-out, or travel along the inner lead fingers interfering with wire bonding. The compensation is a chamfer on the peripheral edges and/or interior edges of the package base component and cover component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.