Leaded semiconductor package having temperature controlled lead length
US5455446A · kind A · utility
15Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Jun 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plastic leaded semiconductor package (20) has a semiconductor device (614) encapsulated in the package and mounted to a lead frame (612). The lead frame has a plurality of leads (622) that extend beyond the body (610) of the encapsulated package. Each of the plurality of leads is made from a metal having a predetermined coefficient of thermal expansion. A second metal (627) with a different coefficient of thermal expansion is disposed on at least one portion of each of the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.