Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
US5455455A · kind A · utility
132Cited by
13References
46Claims
0Family size
Inventor
Key dates
| Filing date | Aug 20, 1993 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Aug 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.