Phase change cooling of semiconductor power modules
US5455458A · kind A · utility
88Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1993 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Aug 9, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor wafer (22) and substrate (20) are enclosed in housing (12) on heat extracting base (14) . The space within the housing is filled with a phase change material (28) which absorbs heat at a transitional temperature below the critical temperature of the semiconductor wafer to absorb heat during peak loads. Wires (44) thermally couple the wafer (22) to the phase change material (28). Heat is extracted from both the semiconductor wafer and the phase change material through the base (14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.