Method of abrading with boron suboxide (BxO) and the boron suboxide (BxO) articles and composition used
US5456735A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 1994 |
| Grant date | Oct 10, 1995 |
| Priority date | — |
| Expiry date | Mar 24, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1418
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of removing material from a surface comprising abrading a surface comprising the step of abrading a surface with an abrasive tool or an abrasive powder comprising a boron suboxide (BxO) composition, wherein during the abrading step the boron suboxide (BxO) composition is maintained at low temperatures. The abrasive which is from the boron suboxide (BxO) family of compounds exhibits an unexpectedly high quality of abrading comparable with the highest quality particulate natural and synthetic diamond, which has a hardness about double that of the boron suboxide (BxO) of the present invention. Further, the invention includes a lapping and polishing powder and lapping slurry wherein the powder is made from a dense, finely crystalline boron suboxide material with a Knoop hardness KHN.sub.100 of at least about 2800 kg/mm.sup.2 and preferably at least 3800 kg/mm.sup.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.