Method of planarizing trench structures

US5456797A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Lothar Weber · Stuttgart, DE
• Monika Lorkowski · Gerlingen, DE
• Klaus Mayer · Prien am Chiemsee, DE

Key dates

• Filing date: Jan 14, 1994
• Grant date: Oct 10, 1995
• Expiry date: Jan 14, 2014

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/3692
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method of planarizing trench-like structures, particularly on semiconductor substrates, by filling in the trench-like structures. For this purpose, a pre-polymer is selectively filled into the trench-like structures, is hardened and is then expanded.