Thermal detector apparatus and method using reduced thermal capacity
US5457318A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1994 |
| Grant date | Oct 10, 1995 |
| Priority date | — |
| Expiry date | Apr 29, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.