Patent · US Expired

Thermal detector apparatus and method using reduced thermal capacity

US5457318A · kind A · utility

13Cited by
26References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 29, 1994
Grant dateOct 10, 1995
Priority date
Expiry dateApr 29, 2014

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49144
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.