Frangible semiconductor wafer dicing method which employs scribing and breaking
US5458269A · kind A · utility
Inventor
Key dates
| Filing date | Jan 24, 1995 |
| Grant date | Oct 17, 1995 |
| Priority date | — |
| Expiry date | Jan 24, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/325
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for applying a controlled, adjustable strain and strain rate by use of a break wheel to break a frangible semiconductor wafer around previously placed scribe lines formed along a surface of the wafer. Several embodiments of a break wheel are disclosed. One embodiment uses a pair of spaced profiles engageable on opposite sides of a scribe line on the wafer. Another embodiment uses three laterally spaced contact profiles, the center profile having a smaller radius than that of the two flanking contact profiles. Another embodiment uses a complaint break wheel for applying a resilient breaking force to the wafer in a region straddling the scribe line. All embodiments are used with a tilted surface having a break edge with which the scribe line is aligned prior to the application of the breaking force. The tilted surface is adjustable to provide a variable maximum strain limit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.