Patent · US Expired

Method of producing a self-suporting thick-film structure

US5458911A · kind A · utility

0Cited by

3References

20Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Herbert Zimmermann · Freiberg am Neckar, DE
Guenther Stecher · Leonberg, DE

Key dates

Filing date	Dec 28, 1993
Grant date	Oct 17, 1995
Priority date	—
Expiry date	Dec 28, 2013

Classification

Technology area (CPC H)Electricity
CPC primaryH05K1/092
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for producing a self-supporting thick-film structure on a substrate above a recess defined in the substrate, includes applying an active layer onto an auxiliary substrate; positioning the active layer in contact with the substrate and above the recess defined in the substrate; firing the substrate to bond the active layer thereto; and separating the active layer bonded to the substrate from the auxiliary substrate, wherein the active layer has a thermal expansion coefficient which is less than that of the substrate so that a self-supporting thick-film structure is formed above the recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.