Patent · US Expired

Polystyrene-ethylene/butylene-polystyrene hot melt adhesive

US5459193A · kind A · utility

59Cited by
14References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 23, 1995
Grant dateOct 17, 1995
Priority date
Expiry dateFeb 23, 2015

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2666/24
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

An improved hot melt adhesive with low self-adhesion. The adhesive is useful for disposable articles and employs a S-EB-S block copolymer. The adhesive does not require a release liner and has superior stay-in-place properties.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.