Copolyamide melt adhesives for heat sealing textiles
US5459230A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1994 |
| Grant date | Oct 17, 1995 |
| Priority date | — |
| Expiry date | May 27, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S526/935
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The use of copolyamides as melt adhesive for heat sealing is disclosed. At least three monomer components are copolymerized in the copolyamide. These monomer components are selected from the following group: an equimolar mixture of adipic acid and hexamethylenediamine (6,6 salt), lauric acid lactam, 11-aminoundecanoic acid, an equimolar mixture of azelaic acid and hexamethylenediamine (6,9 salt), an equimolar mixture of sebacic acid and hexamethylenediamine (6,10 salt) and an equimolar mixture of dodecane dicarboxylic acid and hexamethylenediamine (6,12 salt), the melting point of the copolyamide being lower than 140.degree. C. and at least 10% by weight of lauric acid lactam and/or 11-aminoundecanoic acid being copolymerized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.